铜汞合金;
Electrochemical behavior of cefazolin sodium at hanging copper amalgam dropping microelectrode and its trace determination
头孢唑啉钠在悬铜汞齐微电极上的电化学行为及其痕量测定
Results There was a statistically significant difference of microleakage between the Gallium Alloy and GK High Copper Amalgam group after 28 days' immersion in 1% Methylene Blue solution ( P < 0.01).
结果镓合金组根尖充填后28天时的微渗漏情况明显优于GK高铜银汞合金组,差异有显著性意义(P
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